CFast Host Connector,H8.35,LOCK type KLS1-CFA-003B
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Product Information
CFast Host Connector,H8.35,LOCK type
Material
Housing:Engineering plastic,LCP with G.F reinforced,black per,UL 94V-0,rate.
Terminal:Phosphor Bronze,per JIS 5210,0.2T
Spring:Piano thread
Metal cover:Stainless steel sheet SUS304 0.2T,
Plating
Solder zone:100u” matte Tin,50u” min,Nickel underplating over all.
CFast Host Connector,H6.05,LOCK type KLS1-CFA-002B
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Product Information
CFast Host Connector,H6.05,LOCK type
Material
Housing:Engineering plastic,LCP with G.F
reinforced,black per,UL 94V-0,rate.
Terminal:Phosphor Bronze,per JIS 5210,0.2T
Metal cover:Stainless steel sheet SUS304 0.2T,
Plating
Solder zone:100u” matte Tin,50u” min,Nickel underplating over all.
CFast Host Connector,H6.05,PUSH PUSH Type KLS1-CFA-002A
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Product Information
CFast Host Connector,H6.05,PUSH PUSH Type
Material
Housing:Engineering plastic,LCP with G.F reinforced,black per,UL 94V-0,rate.
Slider:Engineering plastic,LCP with G.F reinforced,black per,UL 94V-0,rate.
Terminal:Phosphor Bronze,per JIS 5210,0.2T
Spring:Piano thread Metal cover:Stainless steel sheet SUS304 0.2T,
Crank:Stainless rod SUS 304.
Card lock:Stainless steel SUS 304
Plating
Contacts:30u” gold plating in contact area and 100u” min....
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CFast Host Connector, Vertical SMT
Material
Housing:Engineering plastic,LCP with G.F reinforced,black per,UL 94V-0,rate.
Terminal:Phosphor Bronze,per JIS 5210,0.2T
Plating
Contacts:30u” gold plating in contact area and 100u” min.matte Tin in soldering zone,
over entire contact underplated with 50u” min,Nickel over all.
Solder zone:100u” matte Tin,50u” min,Nickel underplating over all.
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CF card Connector 50P,L13.75mm,H3.9mm
Material:
Housing:Thermoplastic,UL94V-V0.White.
Contact:Copper Alloy 0.40T.Gold Flash
On Contact Area Matte-Tin plated on
solder tail all over Nickel plated.
Fixing:Copper Alloy 0.30T.Tin plated on
solder tail all over Nickel plated.
Electrical:
Current Rating:0.5A AC,DC.
Contact Resistance:40mΩ Max.
Insulation Resistance:1000MΩ Min.
Withstanding Voltage:500V AC/minute
Operating Temperature: -45ºC~+85ºC
SD card connector push pull,H2.75mm,with CD pin KLS1-SD112
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Product Information
SD card connector push pull,H2.75mm,with CD pin
Material:
Housing:High Temperature Thermoplastic.
Contact:Copper Alloy.
Shell:Copper Alloy,Plated gold on the solder tails,Underplated Nickel over all.
Plating:
Contact Area:Gold Plated over Ni.
Solder Tail:30u” Min Sn Plated Over Ni.
Electrical:
Current Rating:0.5A.
Voltage Rating:250VRMS
Contact Resistance:40mΩ
Dielectric Withstanding Voltage:500V AC.
Insulation Resistance:100MΩ
Insertion Force:4...
Mid Mount SD card connector, push pull,H1.75mm,with CD Pin KLS1-SD003
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Mid Mount SD card connector, push pull,H1.75mm,with CD Pin
Material:
Housing:LCP S475,UL94V-0.Black.
Shell:Stainless Steel SUS304.
Contact:Copper Alloy C5210.
Finish:
Contact:Gold Plated on Contact Area.Matte Tin 100u” Min On Soldertail Area.50u” Min Nickel Plating Overall.
Shell:30u” Min Solderable Nickel Plating Overall.
SD card connector push push,H2.8mm,with CD pin KLS1-SD-001 / KLS1-SD-101
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SD card connector push push,H2.8mm,with CD pin
Material:
Insulator:High Temperature Thermoplastic,UL94V-0.
Contact:Copper Alloys.Plated 50u” Ni Overall Plated Au Selective Contact Area,Plated 100u” Sn Over Ni On Solder Area.
Shell:Plated 50u” Ni Overall.
Electrical:
Voltage Rating:125V AC/DC
Current Rating:0.5mA AC/DC Max.
Ambient Humidity Range:95% R.H. Max.
Contact Resistance:100mΩ Max.
Insulation Resistance:1000MΩ Min./500V DC
...
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5 in 1 Card Connector,H4.3mm
Material
Insulator:Hi-Temperature Plastic,UL94V-0,Color:Black
Terminal:Copper Alloy,Selective Gold Flash Plating On Contact Area,AND 50U” Min Nickel Underplated On Allover
Shell:Stainless Stell,50u” Nickel Underplated On Allover,Gold Flash On Solder PAD
Electrical
Insulation resistance:1000Μ min.AT DC 500V DC
Withstand voltage:250V ACrms FOR 1 Minute
Contact resistance:100mΩ max.AT 10mA/20mV max
Current Ratin...
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Micro SD 4.0 card connector push push
Material:
Plastic:LCP,Thermoplastic UL94V-0.Black.
Contact:Copper Alloy.
Shell:Stainless Steel.
Plating:
Contact Area:Au 3u” Over Ni 50u”.
Solder Tail Area:Matted Tin 80u” Min. Over Ni 50u”.
Solderability:Over Plating Ni 50″ Over All.
Micro SD card connector push push,H1.28mm,with CD pin KLS1-SD113
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Micro SD card connector push push,H1.28mm,with CD pin
Material:
Insulator:High Temperature Thermoplastic LCP SZ6505,UL94V-0,Black.
Contact:Berylliun Copper (7035-TM06,T=0.15mm),
Plated 80u” min Ni overall plated 1u” min Au over Ni on solder area.
Shell:SUS301-3/4H T=0.10mm.Solder tail plated 1u” min Au overll 50u” min Ni.
Electrical:
Current Rating:0.5A AC/DC max.
Voltage Rating:12V AC/DC
Ambient Humidity Range:95% R.H. Max.
...