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Product Information
4 pin pogo pin connector Plug-in type type
Housing: PPA, PA46, PA9T, LCP
Pogo Pin OEM
PACK:
Bulk: aluminum foil bag.
Reel: diameter Φ330mm; carrier tape width: 12, 16, 24, 32, 44mm.
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Electrical performance | ||||
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1 | Contact impedance | 30 mohm Max at working stroke | Top-Link factory testing standard* | |
2 | Insulation Resistance | 500 Mohm Min | EIA-364-21 | |
3 | Dielectric Withstanding Voltage | No flash-over,air discharge,breakdown or leakage | EIA-364-20 | |
4 | Temperature Rise vs Current Rating | 30 °C Max. temperature rise at specified current |
EIA-364-70 | |
Mechanical performance | ||||
1 | Spring force | refer to product drawing | EIA-364-04 | |
2 | Retention Force | 0.5Kgf(4.5N)Min. | EIA-364-29 | |
3 | Durability | 10,000 cycles Min. No physical damage Resistance after test 30 mohm Max. |
EIA-364-09 | |
4 | Vibration | No physical damage,No electrical discontinuity more than 1i second. | EIA-364-28 | |
5 | Mechanical Shock | No physical damage,No electrical discontinuity more than 1i second. | EIA-364-27 method A | |
Environmental | ||||
1 | Solderability | solder coverage area Min.95% | EIA-364-52 | |
2 | Salt Spray Corrosion | No physical damage. Resistance after test 100 mohm Max. | EIA-364-26 condition B | |
3 | Resistance to Solder heat(IR/convection) | No cracks,chips,melting,orblister | EIA-364-56 | |
4 | Humidity | No physical damage, Resistance after test 100 mohm Max. | EIA-364-31,method ii,condition A | |
5 | Thermal Shock | No physical damage, Resistance after test 100 mohm Max. | EIA-364-32,method ii | |
6 | Temperature Life | No physical damage, Resistance after test 100 mohm Max. | EIA-364-17,condition A,condition 4 | |
Environmental | ||||
1 | peel force | 10-130 gf | EIA-481 | |
2 | Drop Test | Refer to drop test Standard of Molex |