KLS1-NGFF01-3.2-B-G1U

Height:3.2mm
Type:A,B,E,M
Gold Plating:G1U-Gold 1u”   G3U-Gold 3u”  G30U-Gold 30u”

1:Designed for both single- and double-sided modules
2:Available in various keying options for module cards

3:Support PCI Express 3.0, USB 3.0, and SATA 3.0

4:Choice in height, position, design, and keying option

5:Available in various heights

Material Specification:   

Housing: LCP+30% G.F UL94 V-0.Black

Contact: Copper Alloy (C5210) T=0.12mm.

Leg: Copper Alloy (C2680) T=0.20mm.

Contact: see P/N.

Leg: Matte Tin 50μ” min. overall, Nickel 50μ” min. underplated.

Insertion force: 20N max.

Withdrawal force: 20N max.

Durability: 60 cycles min.

Vibration:  No electrical discontinuity greater than 1u second. shall occur;

Mechanical shock: 285G half sine/6 axis. no electrical discontinuity greater than 1u second shall occur;

Current Rating: 0.5A (per pin).

Voltage Rating: 50V AC (per pin).

LLCR: Contact 55mΩ max.(initial), 20mΩ max. change allowed (final).

Insulation Resistance: 5,000MΩ min. at 500V DC.

Dielectric withstand voltage: 300V AC/60s.

IR Reflow:

 The peak temperature on board shall be maintained for 10 seconds at 260±5°C.

 Operating temperature range: -40°C~85°C(without loss function).

 All parts RoHS and Reach compliant.