Order Information
KLS1-NGFF01-3.2-67-B-G0

Plating:1u"~30u" GoldG1U-Gold 1u" G3U-Gold 3u"G30U-Gold30u"

• 0.5mm pitch with 67 positions
• Designed for both single- and double-sided modules
• Available in various keying options for module cards
• Support PCI Express 3.0, USB 3.0, and SATA 3.0
• Choice in height, position, design, and keying option
• Available in various heights
  
• Material Specification:
• Housing: LCP+30% G.F UL94 V-0.
• Contact: Copper Alloy (C5210) T=0.12mm.
• Leg: Copper Alloy (C2680) T=0.20mm.
• Plating Specification:
• Contact: see P/N.
• Leg: Matte Tin 50μ" min. overall, Nickel 50μ" min. underplated.
• Mechanical Performance:
• Insertion force: 20N max.
• Withdrawal force: 20N max.
• Durability: 60 cycles min.
• Vibration:No electrical discontinuity greater than 1u second. shall occur;
• Mechanical shock: 285G half sine/6 axis. no electrical discontinuitygreater than 1u second shall occur;
• Electrical Performance:
• Current Rating: 0.5A (per pin).
• Voltage Rating: 50V AC (per pin).
• LLCR: Contact 55m? max.(initial), 20m? max. change allowed (final).
• Insulation Resistance: 5,000M? min. at 500V DC.
• Dielectric withstand voltage: 300V AC/60s.
• IR Reflow:
  The peak temperature on board shall be maintained for 10 seconds at260±5°C.
  Operating temperature range: -40°C~85°C(without loss function).
  All parts RoHS and Reach compliant.